The Swiss Nanoscience Institute (SNI) at the University of Basel is excited to announce the addition of two advanced tools to its Nano Fabrication Lab: the PEALD TFS200 from Beneq and the Ellipsometer FS8 from FilmSense.

PEALD TFS200: Precision thin film deposition

The Plasma-Enhanced Atomic Layer Deposition (PEALD) TFS200 enables the deposition of ultra-thin, high-quality insulating layers (e.g., aluminum oxide, hafnium oxide) with sub-nanometer accuracy. Key features include:

• Load-lock system for contamination-free processing.
• Substrate flexibility: from millimeters to 200 mm (8-inch) wafers.
• Dual deposition modes: Thermal ALD (up to 450°C) for traditional high-temperature processes and Plasma ALD for low-temperature deposition (down to room temperature), reducing thermal stress and defects.

The tool uses self-limiting ALD cycles to achieve monolayer precision, making it ideal for quantum device fabrication, including qubit prototypes based on semiconductor nanomaterials (SiGe, GaAs, 2D materials like graphene).

Ellipsometer FS8: Non-destructive film characterization

The FS8 Ellipsometer provides rapid, non-destructive measurements of thin film thickness and refractive index by analyzing polarization changes in reflected light across eight wavelengths. Future integration with the PEALD will enable in-situ monitoring without breaking vacuum.

For more information have a look at the video and contact the SNI Nano Fabrication Lab.